尚豐科技向用戶提供專業(yè)的的電子束感生電流分析系統(tǒng)EBIC
EBIC原理
當(dāng)掃描電鏡電子束作用于半導(dǎo)體器件時(shí)，如果電子束穿透半導(dǎo)體表面，電子束電子與器件材料晶格作用將產(chǎn)生電子與空穴。這些電子和空穴將能較為自由地運(yùn)動(dòng)，但如果該位置沒(méi)有電場(chǎng)作用，它們將很快復(fù)合湮滅（發(fā)射陰極熒光），若該位置有電場(chǎng)作用（如晶體管或集成電路中的pn結(jié)），這些電子與空穴在電場(chǎng)作用下將相互分離。故一旦在pn結(jié)的耗盡層或其附近位置產(chǎn)生電子空穴對(duì)，空穴將向p型側(cè)移動(dòng)，電子將向n型側(cè)移動(dòng)，這樣將有一靈敏放大器可檢測(cè)到的電流通過(guò)結(jié)區(qū)。該電流即為電子束感生電流（EBIC）。由于pn結(jié)的耗盡層有很多的多余載流子，故在電場(chǎng)作用下的電子空穴分離會(huì)產(chǎn)生很高的電流值，而在其它的地方電流大小將受到擴(kuò)散長(zhǎng)度和擴(kuò)散壽命的限制，故利用EBIC進(jìn)行成像可以用來(lái)進(jìn)行集成電路中pn結(jié)的定位和損傷研究。
EBIC應(yīng)用領(lǐng)域包括但不限于：
1）材料晶格缺陷探測(cè)分析，缺陷以黑點(diǎn)和黑線標(biāo)識(shí)出來(lái)；
2）P-N結(jié)缺陷區(qū)域定位；
3）雙極電路中導(dǎo)致集電極-發(fā)射極漏電電流的收集管路的探測(cè)；
4）探測(cè)額外連接或者多層摻雜；
5）確定靜電放電/電過(guò)載（ESD/EOS）導(dǎo)致的失效位置；
6）測(cè)量減壓層/耗盡層（depletion layer）寬度和少數(shù)載流子擴(kuò)散長(zhǎng)度和時(shí)間（minority carrier diffusion lengths/lifetimes）
等等。
EBIC圖像對(duì)于電子-空穴的重新組合非常敏感，因此EBIC技術(shù)能夠非常有效的對(duì)半導(dǎo)體材料缺陷等進(jìn)行失效分析。
BenifitsMake the link between device characterization and materials properties
Image electrical activity across complete devices
Distinguish between electrically active and passive defects
Correlate electrical activity with composition (EDS) and crystallographic structure (EBSD)
Localise electrical defects with highest resolution
Enable sample preparation for TEM or atom probe microscopy
Avoid alignment errors by directly imaging defects with EBIC in FIB SEM
Use live EBIC imaging to stop milling during sample preparation
Map junctions and defects over large areas
Identify all electrically active defects
Map active areas of junctions and electrical fields
Validate doping profiles and areas
Export calibrated EBIC signal for analysis of materials properties
Measure defect contrast / recombination strength
Extract diffusion length of minority charge carriers
Determine width of depletion regions
Verify device operation modes with built-in biasing and live overlay
Image junctions and fields in delayered devices
Map electrical activity in solar cells under bias
Compare imaged behaviour with device modelling
Access third dimension with depth profiling
Manipulate depth of EBIC signal by changing kV in SEM
Investigate EBIC images of cross-sections in FIB-SEM
Export EBIC depth series for 3D reconstruction
FeaturesThe EBIC system is fully integrated and software controlled
Image acquisition and EBIC module are integrated into one software
All amplification and acquisition settings are software controlled
EBIC signal is automatically quantified and displayed in current values (μA, nA, pA)
The most sophisticated and easy to use EBIC amplifier
Two stage amplification for maximum gain range
Built in -10…+10V DC bias with current compensation
Beam current output for SEM feedback and integration
The most powerful and versatile SEM scanning system – DISS5
Integrated scan generator and image acquisition
Very large image resolution, up to 16k x 16k pixels
Very fast scanning speed, down to 200ns dwell time
Simultaneous 4x analogue and 12x digital counter inputs
Optional electrical sample holder for large area devices
Suitable for solar cells, photovoltaics and light emitting diodes
Flexible mount in plan-view or cross-section configuration
Includes Faraday cups for beam current measurements
Advanced controls are provided for calibration, biasing and scanning
Flexible pre-amplifier gain from as little as 10^3 to as high as 10^10 V/A
Further 0.1…100x gain and 100 μA compensation for optimum imaging
Electronics are optimised for high speed, providing 0.5 MHz at 10^9 V/A
Simultaneous signals are mixed live for correlative microscopy
Up to 4x simultaneous signals
12-bit digitization with signal integration (oversampling)
Live colour mixing tool for visualisation
Current-voltage (IV) tool is integrated for contacts and nanoprobing
Voltage output maximum range is -10…+10 V
Gain selection for current measurements is automatic
IV may also be used for device characterisation
Configurable scan profiles enable custom workflows for efficient use
Fast EBIC scan profile for alignment and navigation
High resolution EBIC scan profile for mapping and analysis
Simultaneous SE/EBIC scan profile for localization
Live signal monitor assists image acquisition and calibration
Live line scan signals are displayed for optimisation
Multiple live signals are displayed simultaneously
The gradation graph improves display of complex shadows
Advanced live scan tool enables advanced beam control
Select points, lines or areas from pre-scan images
Set number of points, step size, binning and averaging
Generate single or multiple diagrams
Export diagrams and/or raw data
Gallery
尚豐科技致力于引進(jìn)推廣先進(jìn)的材料、生物顯微觀測(cè)及微區(qū)分析儀器，向科研人員高附加值服務(wù)。我們擁有一支涉及眾多領(lǐng)域高素質(zhì)的應(yīng)用支持團(tuán)隊(duì)，為各行業(yè)的應(yīng)用需求提供專業(yè)的解決方案和售后服務(wù)。
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